IPC Class 3 High-Reliability Quality
Full compliance with IPC-600 Class 3 standards, with 100% AOI, X-Ray, and electrical testing for zero defects.
Fast-Turn Complex PCB Prototyping
24–72 hour fast-turn for complex boards (HDI, RF, rigid-flex), with stable lead times for high-volume orders.
Design-to-Production Engineering Support
Pre-production DFM review, stack-up optimization, and seamless handoff to our in-house assembly lines.
Share your project requirements, and our engineering team will provide a custom manufacturing solution tailored to your needs.
From standard rigid boards to high-complexity high-frequency designs, we deliver a full range of PCB manufacturing solutions tailored to your application.
Conventional rigid PCB solutions, from single/double-sided boards up to 32+ high-layer-count designs. Ideal for general electronics, consumer devices, and industrial control systems.
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Bendable, space-saving Polyimide (PI) PCBs designed for dynamic applications. Perfect for compact wearables, foldable devices, and products requiring continuous flexing.
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Hybrid rigid + flexible board technology that eliminates connectors, reduces assembly complexity, and improves reliability. The go-to choice for complex 3D electronic packaging.
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High-Density Interconnect boards with microvias, blind, and buried vias. Enables miniaturized, high-performance electronics like smartphones, IoT devices, and medical equipment.
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Engineered with specialized low-loss materials (Rogers, Taconic, etc.) and strict impedance control. Minimizes signal loss for 5G communications, radar systems, and high-speed wireless devices.
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Features an aluminum or copper base for superior thermal management. Widely used in high-power LED lighting, automotive headlights, and power converter modules.
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Offers exceptional thermal conductivity and electrical insulation, built to withstand extreme temperatures. Ideal for aerospace, high-power RF modules, and harsh-environment applications.
Explore capabilitiesFrom rapid prototyping to volume production, our facilities are equipped to handle the most demanding specifications.
 Item |  Mass Production |  Sample/Prototype |
|---|---|---|
| Layers | 4-16 Layers | 4-24 Layers |
| Board Thickness Range | 0.6-3.2mm | 0.4-6.0mm |
| Stack-up (Max) | 4+N+4 | Any layer interconnected |
| Laser Hole (Min) | 4mil (0.1mm) | 3mil (0.075mm) |
| Laser Technology | CO2 Laser Machine | CO2 Laser Machine |
| TG Value | 170°C | 170°C |
| Hole Copper | 12-18µm | 12-18µm |
| Impedance Tolerance | +/-10% | +/-7% |
| Layer Alignment | +/-3mil | +/-2mil |
| Solder Mask Alignment | +/-2mil | +/-1mil |
| Track Width/Spacing (Min) | 2.5/2.5mil | 2.5/2.5mil |
| Annular Ring (Min) | 2.5mil | 2.5mil |
| Through Hole Diameter (Min) | 8mil (0.2mm) | 6mil (0.15mm) |
| Blind Via Diameter (Min) | 4.0mil | 3.0mil |
| Dielectric Thickness (Min) | 3.0mil | 2.0mil |
| Pad Size (Min) | 12mil | 10mil |
| Blind Via Aspect Ratio | 1:1 | 1.2:1 |
Rigorous quality assurance at every stage - from pre-production planning to final delivery
Pre-Production
Quality Assurance Before Manufacturing
Gerber / Drawing Review
Comprehensive file validation and design verification to ensure manufacturability
Premium Material Selection
Top-tier materials from trusted brands: Shengyi, Rogers, Isola, and other industry leaders
100%
Inspection Coverage
ISO 9001
Certified Quality System
24/7
Quality Monitoring
Specialized PCB solutions tailored to your industry's unique requirements
Advanced PCB solutions for the next generation of intelligent vehicles, from EV powertrains to autonomous driving systems.
We deliver more than just circuit boards — we deliver reliability, speed, and peace of mind through our streamlined manufacturing ecosystem.
Our LDI-equipped production lines deliver industry-leading 2mil/2mil trace/space precision. Every PCB goes through 9-stage closed-loop QC, including AOI, X-Ray, and 100% electrical testing, ensuring full compliance with IPC-600 and ISO standards.
Highly automated PCB production lines enable fast prototyping in as little as 24 hours, and reduce mass production cycles by 30% vs. industry averages. Our 99.8% on-time delivery rate ensures your project never misses a deadline.
Stop managing multiple vendors. We handle PCB fabrication, global component sourcing, SMT assembly, and final testing under one roof. Full material traceability and seamless handoffs eliminate delays and ensure consistent quality from prototype to mass production.
From simple rigid boards to complex multi-layer HDI and rigid-flex circuits. Explore our diverse manufacturing experience across industries.
Industrial Control Systems / Smart Home Devices
Smart Home Devices
Telecommunications / Radar Systems
Aerospace & Defense
Power Supply / Automotive
Medical Devices
Data Center Servers / High-End Industrial Control
Share your Gerber files, BOM, and project requirements with us. Our engineering team runs a full DFM review before production, providing actionable feedback to resolve potential manufacturability issues and ensure your design is fully optimized for our manufacturing process.
Leave your contact information and project details, we will contact you ASAP!
